Project
Brand identity
Focus
Heterogeneous integration
chiplet and 3D
System-in-Package (SiP)
Sector
Advanced Semiconductor
Packaging
Founded in 2007, Daspect is the leading
advanced semiconductor organisation
on the island of Ireland.
As the semiconductor industry reaches capacity
with the diminishing returns of Moore’s Law,
the industry-established method of single-die
processors has become increasingly costly with
restrictive yields.
By combining smaller dies and specialised silicon
in heterogeneous integration (chiplets). Daspect
pushes the industry forward with advanced
3D microbump stacking of components with
ultra-high-density interconnects.
The tired tropes of legacy semiconductor
branding with navy and blue gradients, generic
silicon wafers, and staged technical clean-room
specialist photography have dated poorly.
Daspect requires a modern facing visual identity
that elevates the company beyond that of a
vendor to an architect of structural computation.
Project
Brand identity
Focus
Heterogeneous integration chiplet and
3D System-in-Package (SiP)
Sector
Advanced Semiconductor Packaging
Founded in 2007, Daspect is the
leading advanced semiconductor
organisation on the island of Ireland.
As the semiconductor industry
reaches capacity with the
diminishing returns of Moore’s Law,
the industry-established method of
single-die processors has become
increasingly costly with restrictive
yields.
By combining smaller dies and
specialised silicon in heterogeneous
integration (chiplets). Daspect
pushes the industry forward with
advanced 3D microbump stacking of
components with ultra-high-density
interconnects.
The tired tropes of legacy
semiconductor branding with navy
and blue gradients, generic silicon
wafers, and staged technical
clean-room specialist photography
have dated poorly.
Daspect requires a modern facing
visual identity that elevates the
company beyond that of a vendor to
an architect of structural computation.
Project
Brand identity
Focus
Heterogeneous integration
chiplet and 3D
System-in-Package (SiP)
Sector
Advanced Semiconductor
Packaging
Founded in 2007, Daspect is the
leading advanced semiconductor
organisation on the island of Ireland.
As the semiconductor industry reaches
capacity with the diminishing returns of
Moore’s Law, the industry-established
method of single-die processors has
become increasingly costly with
restrictive yields.
By combining smaller dies and
specialised silicon in heterogeneous
integration (chiplets). Daspect pushes
the industry forward with advanced
3D microbump stacking of components
with ultra-high-density interconnects.
The tired tropes of legacy semiconductor
branding with navy and blue gradients,
generic silicon wafers, and staged
technical clean-room specialist
photography have dated poorly.
Daspect requires a modern facing visual
identity that elevates the company beyond
that of a vendor to an architect of
structural computation.
Daspect provides the high-density
interposer infrastructure and 3D
integration protocols that allow custom
silicon chiplets to communicate at
monolithic speeds with a fraction
of the manufacturing risk.
Daspect provides the high-density
interposer infrastructure and 3D
integration protocols that allow custom
silicon chiplets to communicate at
monolithic speeds with a fraction
of the manufacturing risk.
Daspect provides the high-density
interposer infrastructure and 3D
integration protocols that allow custom
silicon chiplets to communicate at
monolithic speeds with a fraction
of the manufacturing risk.
